Scanning Electron Microscopy (SEM)

for materials testing
and failure analysis

Fractographic, topographic and analytical investigations

Scanning Electron Microscopy (SEM)

for materials testing
and failure analysis

Fractographic, topographic and analytical investigations

Scanning Electron Microscopy (SEM)

The scanning electron microscope is used to perform fractographic, topographic and analytical examinations. The images are displayed simultaneously via the secondary electron (SE) and back-scattered electron (BSE) detectors. We use energy-dispersive micro-area analysis (EDX) for the qualitative and semi-quantitative detection of the elementary composition of the materials to be examined, including phases, foreign matter and non-metallic inclusions (NME). The results are displayed in graphs and tables or as spatially resolved images using the mapping function.
 

  • Detection of microscopic fracture characteristics
  • Microstructure analyses
  • Determination of fracture origin areas
  • Fracture propagation analyses
  • Detection of fracture parameters
  • Detection of foreign phases (inclusions, impurities)
  • Detection of defects
  • Particle analyses
  • Energy-dispersive micro-area analysis
  • 3D display
  • Colour coding of details

IABG  Failure Analysis Hotline

Examination methods materials testing and failure analysis

For the characterisation of systems, components, materials and defects we use the following examination methods: