- Services
- Materials Testing and Failure Analysis
- Macroscopy and Stereoscopy
- Metallography / Materialography
- Hardness Testing
- Scanning Electron Microscopy
- Zeiss Merlin Gemini Scanning Electron Microscope
- Chemical and Physical Materials Analyses
- Non-destructive Testing
- X-Ray Inspection Systems
- Environmental Simulation
- Additive Manufacturing
- Powder characterization procedure PowderGenetics®
- Residual Stress Analysis
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Scanning Electron Microscopy (SEM)
The scanning electron microscope is used to perform fractographic, topographic and analytical examinations. The images are displayed simultaneously via the secondary electron (SE) and back-scattered electron (BSE) detectors. We use energy-dispersive micro-area analysis (EDX) for the qualitative and semi-quantitative detection of the elementary composition of the materials to be examined, including phases, foreign matter and non-metallic inclusions (NME). The results are displayed in graphs and tables or as spatially resolved images using the mapping function.
- Detection of microscopic fracture characteristics
- Microstructure analyses
- Determination of fracture origin areas
- Fracture propagation analyses
- Detection of fracture parameters
- Detection of foreign phases (inclusions, impurities)
- Detection of defects
- Particle analyses
- Energy-dispersive micro-area analysis
- 3D display
- Colour coding of details
IABG Failure Analysis Hotline
- Phone: +49 89 6088-2441
- Mobile: +49 151 6131 3167
- schadensanalyse@iabg.de
Examination methods materials testing and failure analysis
For the characterisation of systems, components, materials and defects we use the following examination methods:
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